How to use hot air guns?

Hot air gun is one of the important tools of communication equipment maintenance, mainly by the pump, airflow stabilizer, linear circuit board, handle, housing and other basic components. Its main function is to remove the welding small chip components and chip integrated circuit. Correct use of hot air gun can improve the efficiency of maintenance, if used improperly, will damage the phone motherboard. Such as some maintenance personnel remove amplifier or CPU. It is found that the mobile phone circuit board out solder joints, plastic cable seat and a keyboard seat is damaged, even short circuit phenomenon. This is actually the maintenance personnel do not understand the characteristics of hot air gun. Therefore, how to correctly use the hot air gun is the key to the maintenance of mobile phone.
1. blow welding small patch components in the method of cell phone in the small patch elements mainly include chip resistors, chip capacitors, chip inductors and chip transistors, etc.. For these small components, the general use of hot air gun for blowing. Must grasp the air volume, the wind speed and the direction of the air flow when blowing welding. If not handled properly, not only will the small components blow run, but also will damage the large components. Blow welding small patch components generally use small nozzle, temperature of hot air gun to 2~3 block, 1~2 block to the wind. After waiting for temperature and flow stability, then available finger clamp live small SMD components, the hot air gun nozzle from the desire of components for disassembly 2~3CM, and maintain the vertical and in component in the direction of the uniform heating and components around the solder melting, finger clamp will be removed. If welding small element to element is placed, if lack of tin solder joints, available iron in the solder joints on the filling amount of solder, welding method and removal methods like, as long as the attention temperature and airflow direction can be.

2. Blowing solder integrated circuit using a hot-air gun to blow the solder integrated circuit, first of all, we should put the right amount of flux is coated on the surface of the chip, this can prevent dry blowing, and can help at the bottom of the chip solder joints evenly melt. Due to the patch integrated circuit size is relatively large, in blow welding can use of mouth nozzle, the temperature of the hot air gun can be adjusted to 3 ~ 4 block, air quantity can be adjusted to 2 to 3 block, air gun nozzle from about 2.5cm chip is appropriate. Blowing welding should be above the chip uniform heating, until the bottom of the chip solder melts down completely. At this time using a finger clamp will take the entire chip. Is needed to explain, in blowing the welding of such chips, attention must be paid to affect the surrounding components. Also chip removal, cell phone circuit boards will be residual tin, available iron the tin residue removal. If the welding chip, the chip should be aligned with the corresponding position of the circuit board, welding methods and removal methods are the same. (remind you: hot air gun nozzle to the vertical welding surface, the distance to moderate; hot-air gun temperature and airflow should be appropriate; blow welding mobile phone circuit board should be the standby battery, so as to avoid the battery thermal explosion; welding blowing is finished, should be promptly shut down power supply hot air gun, lest the handle in long-term high temperature, shorten the service life. Mobile phone display screen with hot air gun for welding.